GT-OVEN-053
GENIE TECHNICS drying oven for removing moisture from printed circuit boards at 105 °C before soldering. 343-litre chamber (700 × 700 × 700 mm) and 200 °C maximum temperature.
Characteristics
- Application: moisture evaporation from printed circuit boards before soldering
- Reference drying temperature: 105 °C
- Useful volume: 343 L
- Maximum temperature: 200 °C
- Internal dimensions: 700 × 700 × 700 mm
- Catalogue match: France Etuves XUP343 (also XUE343 / XL0343)
- Not frozen as 100% COMPLIANT until firm quote + lead time received
GENIE TECHNICS GT-OVEN-053